From August 8th to August 15th, 2019, Hengwen Zheng, an undergraduate of Mechanical and Electrical Engineering of Zhejiang University, followed the instructor Yang Lan, who was invited to visit Simon Fraser University in Canada to participate in the IEEE International Flexible Electronics Technology Conference. (IEEE International Conference on Flexible Electronic Technologies). According to the statistics of the organizers of the conference, Heng Wenzheng is the youngest author and the youngest participant of the conference. The student’s contribution as the first author is entitled “The role of the highly flexible tactile sensor geometry based on a porous sponge on the perceptual properties. "Facile Fabrication of Highly Soft Tactile Sensor based on Porous Sponge with Geometry Effect on Sensing Characteristics." was included in the conference.
