Academic Report : Recent Advances in MEMS/NEMS Technology
Speaker: Chengkuo Lee, Associate Professor
Time：2015.7.3 3:30PM
Location：Conference Room, 4th Floor, Hydraulic Old Building, Yuquan Campus
Abstract:
Since the invention of silicon microfabrication technology in early 1960s, the integrated circuit (IC) has changed our world. During last 40 years, the semiconductor industry has come up as the fastest growing industry in our history. This silicon microfabrication technology was later extended to machining mechanical micro devices—that was later called microelectromechanical systems (MEMS). The ever-advancing semiconductor process technology renders making single-crystal silicon nanowires (SiNWs) via top-down fabrication approach. This technology further enables the potential of downsizing the piezoresistive MEMS sensors to a new category of sensors in nanometer scale, i.e., nanoelectromechanical systems (NEMS) sensors. These piezoresistive NEMS sensors using SiNWs as sensing elements demonstrate higher sensitivity and lower power consumption with great potential of being implantable sensors because of small footprint. On the other hand, self-sustained autonomous sensor nodes have attracted great interests in the home healthcare and point-of-care applications. To facilitate these sensor nodes, sensors of low power consumption and self-sustained power source are required to be developed. Various sensors and MEMS energy harvesters developed at our group will be highlighted. Moreover, programmable metamaterials using MEMS actuators have been successfully developed. The progress in tunable MEMS based metamaterials opens the opportunity of novel THz MEMS.
Brief Bio:
Chengkuo Lee (S’93 -M’96) received the M.S.degree in materials science and engineering from the National Tsinghua University, Hsinchu, Taiwan, in1991; the M.S. degree in industrial and system engineering from Rutgers University, New Brunswick, NJ, in 1993; and the Ph.D. degree in precision engineering from the University of Tokyo, Tokyo, Japan, in 1996. He worked as a Foreign Researcher in the Nanometerscale Manufacturing Science Laboratory of the Research Center for Advanced Science and Technology, University of Tokyo, from 1993 to1996. He has also worked in the Mechanical Engineering Laboratory, AIST, MITI of Japan as a JST Research Fellow in 1996. Thereafter, he became a Senior Research Staff Member of the Microsystems Laboratory, Industrial Technology Research Institute, Hsinchu, Taiwan. In September 1997, he joined Metrodyne Microsystem Corporation, Hsinchu, Taiwan, and established the MEMS device division and the first micromachining fab for commercial purposes in Taiwan. He was the Manager of the MEMS device division between 1997 and 2000. He was an Adjunct Assistant Professor in the Electrophysics Department of the National Chiao Tung University, Hsinchu, Taiwan, in 1998, and an Adjunct Assistant Professor at the Institute of Precision Engineering of National Chung Hsing University, Taichung, Taiwan, from2001 to 2005. In August 2001, he cofounded Asia Pacific Microsystems, Inc.(APM), where he first became Vice President of R&D before becoming Vice President of the optical communication business unit and Special Assistant to the Chief Executive Officer in charge of international business and technical marketing for the MEMS foundry service. From 2006 to 2009, he was a Senior Member of the Technical Staff at the Institute of Microelectronics, A-STAR, Singapore. Currently he is an associate Professor in the Department of Electrical and Computer Engineering, and director of Center for Intelligent Sensors and MEMS at National University of Singapore, Singapore. He is the co-author of Advanced MEMS Packaging (McGraw-Hill, 2010). He has contributed to more than 250 international conference papers and extended abstracts, and 180 peer-reviewed international journal articles in the fields of Sensors, Actuators, Energy Harvesting, MEMS, NEMS, nanophotonics, and nanotechnology. He is also the holder of nine U.S. patents.