Academic Report：The Era of Embedded Intelligence
Speaker：Prof. Michael Pecht
Time：2019.6.18 13:00
Location：Conference Room, 4th Floor, Hydraulic Old Building, Yuquan Campus
Abstract：
The Internet of Things is not only permitting the sensing and control of numerous products and systems but enabling autonomous activities and the collection of otherwise unattainable information. With this information we can now assess a system under its actual application conditions and anticipate its operational behavior. One goal is to integrate sensor data with models that enable in-situ assessment of the “health” (e.g. deviation or degradation) of a system from an expected normal operating condition and also predicts the future state of the system based on current and historic conditions. This presentation discusses the possibilities for the future and some methods used for anomaly detection and prognostics, including the monitoring and reasoning of parameters that are precursors to impending “failure”, such as shifts in performance parameters; and the modeling of stress and degradation utilizing life cycle loads.
Prof Michael Pecht has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, and an SAE Fellow. He is the editor-in-chief of IEEE Access, and served as chief editor of the IEEE Transactions on Reliability for nine years, and chief editor for Microelectronics Reliability for sixteen years. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in automotive safety, and as an expert to the U.S. Food and Drug Administration (FDA). He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is currently a Chair Professor in Mechanical Engineering and a Professor in Applied Mathematics, Statistics and Scientific Computation at the University of Maryland. He has written more than twenty books on product reliability, development, use and supply chain management. He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has written over 700 technical articles and has 8 patents. In 2015 he was awarded the IEEE Components, Packaging, and Manufacturing Award for visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronic packaging reliability. He was also awarded the Chinese Academy of Sciences President's International Fellowship. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award.